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piranha_solution [2013/11/17 02:03]
piranha_solution [2013/11/17 02:08]
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   * "​spin-on polyimide >17,000 nm/​min"​   * "​spin-on polyimide >17,000 nm/​min"​
   * "​Oxygen plasma eats polyimide at 370nm/min and is "slow or zero" for Cu/Al"   * "​Oxygen plasma eats polyimide at 370nm/min and is "slow or zero" for Cu/Al"
 +"The Piranha (also known as sulfuric-peroxide)
 +parts 96% H SO :1 part 30% H O .
 +used here is a mix of
 +. The hydrogen peroxide is added just before use.
 +It is used as a cleaning solution that strips organics and some
 +metals. In these tests, it was indeed found to etch photoresist,​
 +the resist pen, and polyimide very rapidly, but only slowly
 +attacked the Parylene C. It also etched aluminum, nickel, and
 +silver rapidly. Chromium was etched slowly, which allows it to
 +be used for the cleaning of photomasks."​ [Etch rates part II]
 ====== References ====== ====== References ======
-Acid comaptible materials (AMC): http://​www.cheresources.com/​invision/​topic/​19132-piranha-caros-acid-peroxymonosulfuric-acid-compatible-materials/​+  * Acid comaptible materials (AMC): http://​www.cheresources.com/​invision/​topic/​19132-piranha-caros-acid-peroxymonosulfuric-acid-compatible-materials/​ 
 +  * [[http://​microlab.berkeley.edu/​labmanual/​chap1/​JMEMSEtchRates2(2003).pdf|Etch rates part II]]
piranha_solution.txt · Last modified: 2013/11/17 02:08 by mcmaster
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